HONOLULU, June 12 (UPI) -- Texas Instruments said Monday it had developed a 45-nanometer wet lithography process that doubles the number of chips it can produce on a silicon wafer.
The breakthrough should lead to a ramping up of output from the 45-nm process that is poised to become the industry standard for next-generation wireless-phone processors and other devices.
"This gives our customers early access to faster, smaller and lower-power products," TI Vice President Hans Stork said prior to a conference in Hawaii.
The 45-nm process is expected to lead to such services as 3-D graphics for video conferencing and improved cell-phone video quality without a corresponding increase in size or power consumption.
The new manufacturing process includes a first-time use of 193-nm immersion photo-lithography to accomplish the density goals that can't be reached through dry lithography at 45 nm. Immersion lithography places a thin layer of liquid between the wafer and the lens, which makes it easier to transfer the tiny circuit designs.
