Georgia Institute of Technology researchers led by Professor Paul Kohl and graduate student Todd Spencer developed the improved signal transmission line to link high-speed signals between computer chips.

As computers become more complex, the demand increases for more connections between computer chips and external circuitry, said Kohl. Improving such connections increases the amount and speed of information that can be sent through a computer.

The vertical connections between chips and boards are currently formed by melting tin solder between the two pieces and adding glue to hold everything together. Kohl's research showed replacing the solder connections with copper pillars creates stronger connections and the ability to create more connections.

"Circuitry and computer chips are made with copper lines on them, so we thought we should make the connection between the two with copper also," said Kohl, who noted the solder and copper can both tolerate misalignment between two pieces being connected, but copper is more conductive and creates a stronger bond.

Kohl presented the research last year in Boston during the fall meeting of the Materials Research Society.