The researchers said their creation could lead to dramatic cost savings and efficiency gains in semiconductor manufacturing and computer chip packaging.

Along with allowing enhanced performance and cost savings for conventional photolithography processes, the researchers said the new material -- called polyset epoxy siloxane, or PES -- is expected to result in a new generation of lower-cost, on-chip nanoimprinting lithography technology.

"With this new material, chip manufacturers will be able to trim several steps from their production and packaging processes, and in turn realize a cost savings," said Professor Toh-Ming Lu. "PES is cheaper and more reliable."

The research appears in the Journal of Vacuum Science and Technology B.